机读格式显示(MARC)

• 000 01857nam a2200325 i 4500

• 001 0000836538

• 005 20250907172800.0

• 008 151031s2016 gw a b 001 0 eng d

• 020 __ |a 9783662488218 (hbk.)

• 020 __ |a 9783662488232 (hbk.)

• 040 __ |a UtOrBLW |b eng |c UtOrBLW |d UtOrBLW

• 050 _4 |a TA349-359

• 090 __ |a TU312/X1

• 093 __ |a TU312 |2 5

• 100 1_ |a Zhang, Qingke, |e author.

• 245 10 |a Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces / |c by Qingke Zhang.

• 260 __ |a Berlin, Heidelberg : |b Springer, |c 2016.

• 300 __ |a xv, 143 pages : |b illustrations ; |c 24 cm.

• 336 __ |a text |b txt |2 rdacontent

• 337 __ |a unmediated |b n |2 rdamedia

• 338 __ |a volume |b nc |2 rdacarrier

• 490 1_ |a Springer theses, recognizing outstanding Ph.D. research, |x 2190-5053

• 504 __ |a Includes bibliographical references and index.

• 520 __ |a This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.

• 650 _0 |a Engineering.

• 650 _0 |a Mechanics.

• 650 _0 |a Structural analysis (Engineering)

• 650 _0 |a Materials science.

• 650 _0 |a Surfaces (Technology)

• 650 _0 |a Thin films.