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题名/责任者:

Molding simulation : theory and practice / Maw-Ling Wang, Rong-Yeu Chang, Chia-Hsiang (David) Hsu.

版本说明:

First edition.

出版发行项:

Cincinnati, Ohio : Hanser Publishers/Munich Hanser Publications, [2018]

ISBN:

9781569906194

载体形态项:

xviii, 513 pages :: color illustrations ; 25 cm

个人责任者:

Wang, Maw-Ling, author.

附加个人名称:

Chang, Rong-Yeu, author.

附加个人名称:

Hsu, Chia-Hsiang (David), author.

论题主题:

Injection molding of plastics-Data processing.

论题主题:

Molding (Chemical technology)

论题主题:

Plastics-Molds-Computer-aided design.

中图法分类号:

TQ320.66

书目附注:

Includes bibliographical references and index.

摘要附注:

This practical introductory guide to injection molding simulation is aimed at both practicing engineers and students. It will help the reader to innovate and improve part design and molding processes, essential for efficient manufacturing. A user-friendly, case-study-based approach is applied, enhanced by many illustrations in color. The book is conceptually divided into 3 parts: Chapters 1-5 introduce the fundamentals of injection molding, focusing the factors governing molding quality and how molding simulation methodology is developed. As they are essential to molding quality, the rheological, thermodynamic, thermal, mechanical, kinetic properties of plastics are fully elaborated in this part, as well as curing kinetics for thermoset plastics. Chapters 6-11 introduce CAE verification of design, a valuable tool for both part and mold designers toward avoiding molding problems in the design stage and to solve issues encountered in injection molding. This part covers design guidelines of part, gating, runner, and cooling channel systems. Temperature control in hot runner systems, prediction and control of warpage, and fiber orientation are also discussed. Chapters 12-17 introduce research and development in innovative molding, illustrating how CAE is applied to advanced molding techniques, including co-/bi-Injection molding, gas-/water-assisted injection molding, foam injection molding, powder injection molding, resin transfer molding, and integrated circuit packaging. The authors come from the creative simulation team at CoreTech System (Moldex3D), winner of the PPS James L. White Innovation Award 2015. Several CAE case study exercises for execution in the Moldex3D software are included to allow readers to practice what they have learned and test their understanding--

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