潍坊科技学院图书馆书目检索系统

Online Public Access Catalogue

题名/责任者:

Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces / by Qingke Zhang.

出版发行项:

Berlin, Heidelberg : Springer, 2016.

ISBN:

9783662488218 (hbk.)

ISBN:

9783662488232 (hbk.)

载体形态项:

xv, 143 pages : illustrations ; 24 cm.

丛编说明:

Springer theses, recognizing outstanding Ph.D. research, 2190-5053

个人责任者:

Zhang, Qingke, author.

论题主题:

Engineering.

论题主题:

Mechanics.

论题主题:

Structural analysis (Engineering)

论题主题:

Materials science.

论题主题:

Surfaces (Technology)

论题主题:

Thin films.

中图法分类号:

TU312

书目附注:

Includes bibliographical references and index.

摘要附注:

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.

豆瓣简介：